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Miniaturization Ism Band Communication System Based On The Mcm-l

Posted on:2007-05-09Degree:MasterType:Thesis
Country:ChinaCandidate:F F LvFull Text:PDF
GTID:2208360185956356Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
Extensive use of T/R (transmit/receive) modules in today for modern communication systems are demanding low weight, smaller dimensions and high reliability. In this paper, microwave T/R front-end for short distance wireless communication is realized in miniature based on low cost MCM-L technology. The main jobs are as follows:1. The performances of I/Q modulation and direct converter receiver are analyzed to set down the system scheme.2. Based on low cost MCM-L technology, the T/R front-end is fabricated. EMC/EMI simulation of special microwave connection and package structure in MCM-L is taken to sum up some effective EMI methods to guide layout design.3. The system characteristics and link index are analyzed to point out key modules in circuit realization.4. Respective scheme, layout design, simulation and optimization during debugging are implemented for key modules including dual frequency synthesizer, low noise amplifier in receiver and power amplifier in transmitter.5. Final system scheme, multilayer layout design and the testing of system communication performance are accomplished. The microwave T/R front-end is integrated on 84mm×52mm multilayer board with thickness of 1.89mm.This size is corresponded to the scale of dual frequency locked-loop using planner circuit.
Keywords/Search Tags:microwave multi-chip modules (MMCM), multilayer, spread spectrum, EMC, miniature
PDF Full Text Request
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