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A Distribution Of Routing Algorithms Based On The Through-hole

Posted on:2007-05-14Degree:MasterType:Thesis
Country:ChinaCandidate:Y Z MaFull Text:PDF
GTID:2208360185956000Subject:Computer software and theory
Abstract/Summary:PDF Full Text Request
In recent years, the technology of integrate circuit(IC) has been developed greatly.Methods and tools of the design in integrate circuit(IC) have also been developed rapidly.After computer aided design(CAD) and electronic design automatic(EDA) were invented, they are used in all of steps of integrate circuit(IC) design.And these tools give devisers much help and enhance the efficiency of the design.But the size of integrate circuit(IC) chip was enlarged greately and the structure of integrate circuit(IC) chip became more and more complex. Under this situation the tools of CAD and EDA don't satisfy the need of design.In the design flow of integrate circuit(IC) physical design is one of the most important steps and costs designers much time. It is at this pivotal step that mainly determines the cost, validity and performance of the product. Physical design has tow important steps: placement and routing.Routing, as an important step in the flow of physical design, was regarded widely.Scientists have done much research work about routing and have brought forward many effective routing algorithms. But the structure of integrate circuit(IC) has varied greately, the current routing algorithms are behind the need of routing in EDA.So we have to develop new routing algorithms to design integrate circuit(IC).In the current production of integrate circuit(IC), we usually package the chip with chemical material to protect chips. Recently, designers developed a new type of package:ball grid array (BGA) package.The BGA package has many I/O pins .Because of this merit ,this kind of package is used widely now.But the package has a new structrue,and the old routing algorithms are not used. We have to develop new routing algorithms for this package.This thesis consists of three parts. The first part introduces the background and significance of this research project, and introduces the main content finally. The second part introduces concepts and knowledge of the integrate circuit(IC) design and package.The third part introduces the realization of the routing algorithm and the...
Keywords/Search Tags:Integrate circuit, CAD, EDA, routing, BGA package
PDF Full Text Request
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