Test Of Integrate Circuit & Test Research Of PCU06ESP

With the developing of the technology, complexity of Integrate Circuit is increasing continually, and meanwhile the electronic products around us have changed day by day. And meantime, the Integrate Circuit has combined with other subject and technique, forming a new direction , a new subject or a new speciality, and it is changing the conventional pattern of speciality devision. The definite ambit between Integrate Circuit and System is different now, and Integrate Circuit is not only the basic of the modern industry and technology, but also the basic of the all other industry of intelligence.With the developing of automobile industry and electronic industry, the electronic technique is applied widely in the modern automobile. As the IC manufacturer we must confirm the capability of the IC that we provide is stable, especially the auto electronic IC . During the test of IC, we need to test some important safe module of the semiconductor 7 times in order to be sure the module is all right. Why the final test cost of the automobile semiconductor is high is that we must ensure that the IC is ZERO CQI(customer quality incident). Hence we pursue the high quality and comprehensive test of the IC, and pursue the perfect function and stable capability IC. For complete a high quality and comprehensive test , we must work with the design principle of the IC , and then find a reasonable method of test.Before the mass production of the Integrate Circuit, we need do the detailed analysis and test of the wafer in order to be sure the design and process of the chip is all right . If no problem during the first step , we can do mass production.Test exists in every phase of integrated circuit manufacture. Tests include chip archetype test before massively manufacturing chips, wafer test during manufacturing, chip test after package and incoming test. The very purpose of the above tests is to find the chips with defects or faults as early as possible. If a chip with defects or faults passes a phase of test, the costs found the defects in next phase will become five to ten times of the last phase. Another reason to test is that chips can come into the market only through effective tests. The time when the chips can come into the market is crucial to enterprise. So we conclude that effective tests can reduce the chip costs remarkably.This research is a part of job of the intern in Freescale Corp..Do the research of the test of PCU06ESP , optimize the test program and deal with the test problme exist. PCU06ESP, which is used in the wheels of automobile to control the turning drive of the auto's brake , is designed by Freescale. Due to the actual application demand , Test engineers program the test procedure with VBT language , and use the program in the TERADYNE's Flex to do the test.As an automotive brake control chip, PCU06ESP must be effective when suffered at hot and cold temperature. In the car, the chip may be under -40℃or +125℃at the worst, so we select-40℃, 25℃and +135℃,as the test condition to make sure the chip can meet the customers'requirement. It contains functional test and parameter test, and for a test company the way for live is the yield, to get the precise result in a short time. The shorter the cycle is , the more the company is competitive.This paper is for analysing the test method for PCU06ESP, optimize test program through debuging and solving the problem we met during the test. Both hardware and software issues are included. The main purpose for this paper is to solve the temperature fail issue and the load board damage issue. In the mass production, we are suffered by temperature fail issue, and it is found that the reading is rising when changed the wait time longer. The temperature fail issue could be fixed through adding more wait time, but new problem comes again, it means that we must pay more for test, which goes against with our goal " cost reduction", so there must be a sulotion for two birds with one stone. I found that this failure could be fixed by setting up the hardware DC30 in advance after studying the test program and the tester, which means that when the other test items are under test, at the same time the hardware for the temperature test is also being set up, and the wait time could be used effectively. So I optimezed the test program through adding some code before the original program. The tester runs 24 hours per day, so some components of the load board may be damaged during the test. It is important for us to find the damaged components in a short time. This paper mainly focus on the program optimizing for PCU06ESP, and write the VBT code for part of FMON module test. The study is based on PCU06, but sulotions or idea can be applied to some other devices, so the further study is valuable.