Heat Source Coupled Field Components Of The Multi-chip Thermal Analysis

The thermal analysis of the Multi-Chip Module (MCM) is crucial for enhancing module reliability. The dissertation discussed the thermal analysis and thermal optimization design of MCM using electronic package reliability thermal optimization design technology, accordingly evaluated MCM thermal characterization and the effect of packaging parameters on MCM by the more accurate, quicker method. The main conclusions as follows:considering the limitation of conventional thermal analysis methods, first interiorly, the dissertation introduced optimization technology—response surface method (RSM) of design of experiment (DOE) into package thermal analysis, and by combining the RSM with the finite element method (FEM) proposed the reliability thermal optimization design technology of electronic package that became a powerful tool of thermal analysis and thermal optimization of MCM.By thermal simulation for MCM using FEM over a variation of technics, cooling conditions and packaging parameters, get main factors that affect MCM thermal performance (individual chip junction temperature) including shell temperature, chip attach thermal conductivity, chip area and cooling conditions.Based on the result of FEM simulation of MCM, optimize thermal analysis process and packaging parameters using RSM that eventually got a set of regression equations predicting individual chip junction temperature. By equations, evaluate MCM thermal performance and the effect of parameters on module and so get idea design factors and optimum thermal characterization.