Computer Simulation Analysis Of The Vulnerability Characteristics Of The Printed Circuit Board Assembly

The frailty is the basis of products packaging designing．At present,themain method of evaluating the frailty of products is the experiment testing．By the experiment testing we can obtain the frailty information of the products,such as its inherence frequency and the shock destroyingboundary．However,this type of experiment will lead to the destruction ofthe products and need much expense． This paper proposes a nondestructive method to obtain the frailtyinformation of the products,namely adapting finite element simulationanalysis technology．And this paper introduces the principle and theimplementation of this method in accordance with the product of SMT PCBAssembly．By this method,we just need to input the information data of the material and the construction of the products．And the program will tell usthe frailty information of the products．...