Research On Welding Technology Of Surface Mount Type Connector

As microelectronics industry development,microelectronics integration chip in type,size,shape structure and manufacturing cycle aspects such as there are a lot of changes,manufacturing and stick chip outfit patterns,process and method has a new requirements.SMT type connector is one of the important direction of the technology of electronic assemblies.In this paper,through test,connectors for SMT process parameters for the related research,including the sheet thickness,the printing quality,SMT,reflow welding process and the setting of temperature curve.After welding the PCB for the related environment to accelerate the experiment,through the X-Ray test equipment to complete the relevant test and analysis.Through the above analysis is summarized in table under different process parameters on the reliability of the type of connector,optimization of solder joint reliability of the process parameters are obtained.