Aging Of Semiconductor Test Systems Heat Transfer Related Failure Analysis

Information industry in the national economy development is more and more important, as its core semiconductor processor development is getting faster. The development situation of semiconductor processors request more complicated production process, parameters of control, failure analysis etc also put forward higher request.In the actual production, the yield and equipment failure rate of the semiconductor processors in the test process, is far lower than that during the trial, one of the main reasons is the failure caused by the heat transfer problems.This dissertation mainly aims at burn in test and the heat transfer related failure analysis, and put forward the corresponding improve solution. Based on the principle of semiconductor burn in test, semiconductor testing machine could test the product with hot fluid circulation structure operation. At the same time, the cycle of cold fluid help cooling the DC-DC voltage converter. This paper discusses two kinds of different caused by heat transfer failure mode, from thermodynamics principle, existing in the research of burn in test of heat transfer mode, theoretically calculating the semiconductor surface temperature parameters; Also discusses the key dc converter circuit and internal structure, analysis with PWM buck dc-dc converter principle. To explore reasons of the occurrence, the key influence caused by the heat transfer, and put forward the corresponding solution to improve them.The product failure scale per week bar chart and equipment parts requirement scale per week show that, using the listed solutions could have obvious positive effect in the failure, basic solves heat conduction medium of dissolved related issues, The failure rate of equipment related parts improved over 70%.