Ic Wafer Processing Chemicals

The dimension of silicon substrate become more and more bigger and the characteristic dimension go diminishing with the development of IC. Therefore, high-precision wafer processing has become the key factor. The manufacturing of high quality silicon wafer is the basic of flatness and parallel and surface perfection. The quality of the silicon surface is determined by the performance of lapping slurry. While the performance of lapping slurry is determined by the various chemical constituents Therefore, more and more attention on the performance of lapping slurry are paid both in domestic and international. The research of slurry prescription play a vital role for promoting the development of integrated circuit industry, it also has an important scientific value in the field of silicon processing.For the request for the slurry and the current problems, combined with the project of Shanghai Sinyang semiconductor Materials Co., Ltd. "the development of silicon slurry," and carried out specific research.First, the background of topics as well as silicon processing is briefly described in the introduction.; in the second chapter, the factors that influence the lapping quality most have been found, at the same time,the projects of selecting in gradients and optimizing prescription have been established; In third chapter, Experimental part is the focus of this paper,the single factor experiments of every ingredients of slurry have been carried out, the relationship between the suspension and abrasive suspension,surfactant and silicon wafer surface smoothness, chelating agents and the content of metal ions adsorbed, which were all analyzed. through SEM, EDS, and other means,the lapping slurry and silicon wafer were characterized, thus obtained the basic prescription is:an organic base B, thickener B (acrylic resins), surfactant 6501, chelating agent B (amino acids), as well as the defoamer CF 643; the fourth chapter,the prescription has been optimized by Orthogonal, eventually got the specific slurry prescription as follows:the content of suspension 1.5g (1.5% wt), the content of organic alkali 6g (6% wt), the content of surface-active agent 1g (1% wt), the content of chelating agent (0.1% wt); Finally, the paper was summarized.In short, through a large number of experiment in this paper, developed a slurry with high-performance suspension, the high ability of chelating and diluting.it improved the quality of silicon surface effectively in a large extent, and laid the foundation for the global planarization.