Study On Capacity Improvement Of Semiconductor Assembly And Test Factory

A typical character in semiconductor industry is high equipment capital input. Generally, the cost of equipment depreciation is the highest element in the final unit cost. For assembly and test factories, OEE (Overall Equipment Effectiveness) is a key index to measure production management and financial cost. The direct purpose of OEE study is to maximize the line capacity, and then it can reach to lower manufacturing cost.The thesis is focus on BGA assembly line in Freescale Tianjin, and study on Wire Bond process OEE by the application of TOC and OEE. Firstly, point out the object of study basing on the analysis of current capacity and demand forecast. Secondly, collect enough raw data on equipment efficiency and build original OEE model, then all major points of work time loss can be clarified. Thirdly, work out an improvement action plan; and well set the KPIs (Key Performance Indices) to measure the execution status of improvement plan. Finally, review and rebuild the capacity model, make sure line capacity will be continually improved.After the study, the BGA line capacity is increased with optimized production, and realized the cost reduction.