The Application Of FEA In The Active Disassembly Devices Design

The recycle of electronic products is a global attention. The main reason of the low-efficiency and high-cost recycle at present is that attention be given during designing products is not enough. Design for disassembly (DFD) can improve the performance of the product disassembly and recycling, but the demolition process is still mainly conducted by hand removal. It can not be bulk, scale, high-efficiency, low-cost demolition and recycling. Smart materials based on active disassembly technology may improve this situation.The paper builds on the existing electronic product design methods and active disassemble using smart material technique. The thesis creates and simulates the typical active disassembly structures, studies the main factors affecting the removal effect of active disassemble structures and gives way to improve removal effect. Moreover, This thesis analyzes the heat transfer effect in the active disassemble products, studies the main affecting factors and gives measures to improve heat transfer efficiency. Through the relevant test results confirms the correctness and feasibility of the proposed method. This thesis provides the basic method and basis for active disassembly of electronic products.