Development Of Thermal-Structural Coupling Analysis Automation System For Micro-Electronic Package Based On Workbench And Excel

With rapidly development of microelectronic technology, packaging density of chip is increased quickly. This has resulted in higher density of thermal current. In addition, the difference of temperature distribution and mismatch of coefficients of thermal expansion (CTE) with different materials inside IC package will generate thermal stress concentration in the package. The overheating and thermal stress has become the main cause of the IC package failure. Therefore thermal-structural analysis is crucial in development of new generation of IC package design.At present, most of package thermal-structural analysis is generally simulated with commercial finite element analysis (FEA) software. Most IC design engineers and package design engineers have many difficulties in performing the thermal analysis because they are familiar with the product structure and design but poor in thermal-structural analysis and FEA simulation skills. To support IC design engineers and package engineers to perform thermal-structural analysis efficiently and accurately, a fully automation simulation system (AutoSim) for the IC package thermal-structural analysis has been developed based on ANSYS Workbench and Excel.At first, the study of thermal-structural analysis and its simulation software are presented. The basic theory of thermal transfer and thermal stress, various definitions of thermal resistance and industrial standards of thermal resistance test are also introduced. According to the summary of the package thermal and stress analysis, the general scheme of development of AutoSim based on customized tools of ANSYS Workbench and Excel is introduced. This paper introduces the development of the environment, function design as well as the entire process flow chart of the AutoSim carefully. In addition, this paper also presents the function and development method of every module of the AutoSim. At last, the AutoSim has been applied in thermal-structural coupling analysis for a PCB level model and a component level model. The results are compared with those from the normal ANSYS simulation. The simulation results have showed that the reliability and efficiency of the new automation simulation system.