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A Study On Micro Electro Mechanical System Process Optimization And Its Application

Posted on:2011-10-27Degree:MasterType:Thesis
Country:ChinaCandidate:S Q FuFull Text:PDF
GTID:2178360302990125Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
MEMS is short for micro electro mechanical system; which is a multidisciplinary high-tech industry, would be one of world's most leading industries .it will have revolutionary consequences for mankind in science and technology; mode of production and life. STUDY of MEMS standard process Study of MEMS standard process directly influenced fabrication of MEMS device. MEMS standard process forms by process flow and layout design rules. This thesis based on micro fabrication technology, according to the structure of silicon based MEMS micro sensor device, utilized equipment in existence developed and optimized a few key processes of MEMS sacrificial-layer process and MEMS bulk process based on silicon. All the works and studies would be shown :1 .Explored the stress and stress gradient controlling technology of the structure layer membrane deposited on polyimide membrane as sacrificial layer. Validated that the physical instability of the polyimide membrane as sacrificial layer under changing temperature by a serial of experiment. Indicated a way to optimize the process of depositing low-stress membrane as structure layer on polyimide membrane.2.Worked over anisotropic silicon etching(ASE) process, the core process of MEMS bulk process based on silicon. Optimized the ASE process, got the optimized result(better verticality of etching profile, lower scallop and lower undercut).Then I design a silicon-based MEMS bulk standard process flow based on micro fabrication technology and structure of MEMS device. This thesis offers technology support for fabrication high-performance MEMS device with high efficiency.
Keywords/Search Tags:MEMS standard process, micro-fabrication technology, layout design rule, anisotropic silicon-etching, polyimide as sacrificial layer, stress and stress gradient controlling
PDF Full Text Request
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