Development Of High Temperture And Dehumidification System For Integrated Circuit

Integrated circuit utilize semiconductor special electricity characteristic to achieve specially function. IC package absorb humidity from environment. When IC package exposure in PCB reflows, the humidity turn to steam, the pressure of steam may cause package blowout,so dehumidification is absolutely necessarily.Two methods can be used for IC desiccation, desiccate and high temperature bake. room temperature dehumidification, apply to those component, which expose under 30°C/85% RH less than 8 hours, use standard desiccation packing method or keep in 25°C±5°C and less than 10%RH cabinet. Bake is more complex than many people know. Presently industry oven is used to high temperature bake and dehumidification. Commonly, industry oven is used for remove humidity by high temperature, industry oven provide common condition for the masses request. But these functions are not enough, we need to get the optimized the bake time and temperature for cost saving and shorten cycle time.Base on practice, this paper introduce integrated circuit high temperature and dehumidification system control and optimization from below side:a) The first chapter introduces the study meaning, background, mostly content, origin for this article and investigation status.b) In second chapter, it introduces the production process and structure for flash memory. Analyze some reason for humidity enters during encapsulation.c) In third chapter, it introduces the experiment design, sample choose and experiment process.d) In fourth chapter, it introduces the date analyses for experiment and come out the optimized bake time for all packages.e) In fifth chapter, it introduces Finite Element Analysis application in high temperature dehumidification system studyf) In the sixth chapter, it introduces the software design and content of oven scan system; explain the use method for oven bake system.g) In seventh chapter, summary the experiment.