Study On Measurement Of Packaging-Induced Stress In High-Power Diode Laser Arrays

The stress induced by high-power diode laser package has a serious impact on the lasing characteristics, reliability and life of the device. In view of this problem, this thesis has analyzed the reason why stress appears and its influence on device operation, and has proposed a method for measurement of stress induced in laser diode array package.Thesis has given a stress distribution model of laser diode arrays, and has analyzed the relationship between the lasing wavelength and internal stress. The experimental platform has been built for measuring the "smile" and spectrum of diode laser arrays, and used to evaluate the diode laser arrays packaged in our laboratory."smile" as low as 0.2～2 micron and stress about 30 MPa～60 MPa along the direction of the array has been obtained for 808nm CW 40W and 100W diode laser arrays packaged with the In solder and oxygen-free copper heat sink. This result meets the packaging situation for DL arrays well.This measurement setup can be used for the experimental research on improvement of high-power diode laser packaging technology, and it provides a new way to evaluate the new solder and high efficiency coolers.