| This dissertation researches a new manufacturing technology which bases on the anisotropic etching of {100} silicon in KOH:H2O for fabricating Micro-Optics-Elements. Through this method, many kinds of optical functional microstructures can be fabricated through some standard microelectronic processes. The fabricated microstructures over silicon wafer can also be made as master mask to fabricate microstructures on other optical material. The main microelectronic processes used by us include optical mask design, SiO2 film deposition, photolithography, SiO2 film etching, and wet etching. The mask design and the wet etching are both key processes in the technology introduced. Two types of optical structures fabricated in silicon wafer using this method are as follows: (1) The optical structures with spherical or aspherical profiles; (2) The diffractive optical elements whose basic phase structures with feature size of micro/nano-meter are aperiodic distributed over the device.Fabrications of the optical structures with spherical or aspherical profiles need designing the optical mask according to the algorithm. The surfaces profiles of the optical structures, which can be made by the technology developed by us, can be exactly reappear, accurately adjusted, and nicely controlled. The diffractive optical elements whose basic phase structures with feature size of micro/nano-meter are aperiodic distributed over the device. The surface profiles of these optical structures are composed of many sampled phase units which have variable structural size and depth. Fabrications of these structures need the same process as fabrications of spherical or aspherical structures, except the second etching time.A new algorithm which can be utilized to design diffractive optical elements for spatial spectrum separation is presented in this dissertation. The basic principle of the algorithm introduced by us is presented. Some design examples are given and analyzed. |
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