Development Of 64-route Thick Film Hybrid Integrated Switching Module

In order to satisfy the special requests of the testing equipment of weight, low power consumption, small volume and power consumption, reliability and high shock-resisitibility to the missiles and satellite, 64-route analog signals switching module based on the thick film hybrid integrated technology is studied in this dissertation.The outstanding point is the combination of the thick film hybrid integrated technology and SMT technique. The conductor of the circuit is printed on the insulated substrate with high electrical performance. The appropriate material is used to the medium of multilayer and intercross wiring. The line welding technology is used to package the circuit into the metal shell. In this way, the high integration of the module is realized to reduce the volume. What is more, the faculty of reliability and high shock-resisitibility is improved largely.The development of the thick film hybrid integrated circuit is introduced in detail in this dissertation. The peculiarity among the thick film hybrid integrated circui, semi-conductor IC and printed circuit are analysed and comparation in order to select the parameter. Then the design cycles, specific requirement and qualification are introduced. Through designing the domain and choosing the material, the thick film hybrid integrated on-off module is accomplished and the substrate, conductor and medium are checked up.At last, this module is packaged, linkaged, and the initial test is finished. The test result indicated that the performance of the module is reliable.