| Along with the ceaseless development of the aerospace industry and weaponry and equipment, more rigorous requirements are given to the micromechanical accelerometer, such as reliability, high shock-resisitibility, weight, low power consumption, etc. Under this background, thick film hybrid integrated micromechanical accelerometer is studied in this dissertation.The development of micromechanical accelerometer is introduced in detail in this dissertation, and analyzing the integrating technology of micromechanical accelerometer, the thick film hybrid integrating technology is selected, and designs the integrating project. According to the structure of the micromechanical accelerometer chip and the connecting of the Wheatstone bridge, the modulation circuit of the micromechanical accelerometer is designed. The circuit power supply method of integrated micromechanical accelerometer is using a current source, and by means of two point compensation, the output of silicon sensing element is compensated for with the help of resistance network. The design of the circuit is adopted the style to be beneficial to the yielding and debugging, and also reduces the workload.Aiming at the characteristic of this research project, an entire series of independent processes for the thick film hybrid micromechanical accelerometer is designed, and also given the layout. The micromechanical accelerometer integrates diffusion silicon sensing element, circuit for temperature compensation and signal conditioned circuit on a ceramic wafer in the form of thick film hybrid IC, through using thick film technology and surface mounting technology. The performances of the hick film hybrid micromechanical accelerometer are tested in this dissertation, and the testing results indicate that the thick film hybrid micromechanical accelerometer haves good performances,and also prove that the correctness of the design and the feasibility of the fabrication technology processes. |
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