Study On Multi-Resistor Networks In Electro-Thermal Analysis

At present, cooling of integrated power devices becomes a difficult problem while electronic components and circuits and systems tend to be high-speed,high-power,multi-terminal,narrow-pitch. It is considered to be one of the three essential problems of electronic industry. As one of the deciding factors of devices'reliability, electro-thermal design has come to people's attention. Electro-thermal analysis is an important and influential part in thermal design. Unfortunately, few of current thermal analysis approaches could meet the needs of precision, economy and convenience simultaneously.This study aims at exploring a method to calculate values of package networks, which is precise enough and suitable as well as convenient for engineering use. The main content of our research is to confirm networks'forms of some packages, which are most frequently used nowadays, and to calculate values of the networks. The form of a package depends on it's construction and materials. Optimum values of networks could be calculated by multi-target limited inversion arithmetic. The objective function is founded following Kirchhoff laws and proper optimization algorithm is chosen. To get the input data for the calculation, we designed a series of numerical experiments- orthogonal experiments.Precision of output networks values could be tested, by comparing it's temperature with compact model's within the same basic parameters. The validity of our method could be validated, by computing a PCB's temperature and comparing that with tested temperature. Finally, the result has showed the correctness and convenience of our explored method.