electronic package - Globe Thesis

Keyword [electronic package] Result: 1 - 20 \| Page: 1 of 2
1.	Thermal Management Of Supercomputer Subsystem And Manufacture & Thermo-mechanical Reliability Of 3D-MCM For Wireless Sensor Network
2.	Reliability Study Of CSP Board-Level Package Under Drop Impact Load
3.	Simulation Of Mechanical Behavior Of Plastic Electronic Package Under Temperature And Humidity Environment
4.	Study On Multi-Resistor Networks In Electro-Thermal Analysis
5.	Development Of Thermal-Structural Coupling Analysis Automation System For Micro-Electronic Package Based On Workbench And Excel
6.	Vibration Analysis And Reliability Research Of Packaging On LTCC Substrate
7.	Investigation Of Mechanical Behaviors Of Solder Joints Under Drop Impact Loading
8.	Development Of Moisture Analysis Automation System For Micro-Electronic Package Based On ANSYS Workbench
9.	Electrodepostion Of Micro-bumps Applied To 3-d Electronic Package And Research On Low Temperature Solid State Interconnection Technology
10.	Investigation Of Interfacial Stress Singularity In Microelectronics Packages
11.	Study On SiC/Cu Electronic Packing Materials Made Through High Velocity Flame Spraying Technique
12.	Thermodynamics Analysis And Fatiguelife Prediction Of Typical Electronic Packages
13.	Plastic Power Device Cu / Emc Interfacial Delamination Failure Of Experimental And Computational Analysis
14.	Research On Methord Of Defects Detection For Electronic Package Based On Infrared Thermography
15.	Dynamic Bending Test And Simulation Of PBGA Packages
16.	Reliability Investigation Of Lead-free Micro-electronic Packaging Solder Joint Under Electromigration
17.	Experimental Investigation Of Tensile Strength And Fracture Mode Of Imc Layer In Soder Joints
18.	Research Of The Electromagnetic Compatibility Characteristics Of Typical Package
19.	Numerical Study On Impact Failure Of Electronic Packaging Component
20.	Study On The Measurement And Finite Element Simulation Of Power Electronic Package
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