Research On IGBT Cooling System For High-power Electronic Components

IGBT is a new type of high-power electronic components,which has a wide range of application scenarios in my country's manufacturing industry.The more common ones are used in frequency converters,switching power supplies,rail transit and electric vehicles.As the core component of the pure electric vehicle motor controller,IGBT chip module has the advantages of fast switching speed,low driving power,reduced saturation voltage,and high current-carrying density.However,with the rapid development of integrated circuits,the degree of integration is becoming more and more High,the power density of electronic components increases,resulting in extremely high heat generation,which will lead to more safety hazards.Therefore,the research on the heat dissipation system of high-power electronic components IGBT has important theoretical research significance and engineering application value.This paper first analyzes the overheating failure modes of IGBT electronic component chip modules,and then studies the heat conduction principle and common heat dissipation methods of the high-power device heat dissipation system,and then formulates the electric vehicle motor controller IGBT chip heat dissipation plan,and establishes series,parallel,and series Three radiator structure models are connected in parallel with runners,and a new composite multi-loop structure model is proposed on this basis.Four radiator structures are simulated and analyzed using FLUENT.Four radiator structures are analyzed from the dimensions of temperature,speed,and pressure.The heat dissipation effect of this structural model has been verified through comparative analysis to verify the best comprehensive performance of the new composite multi-loop structure.Then,on the basis of this structure,a spoiler column is added for the thermal-fluid-structure coupling analysis.Finally,the influence of the changes of different parameters on the heat dissipation performance of the radiator during operation is analyzed,and its laws and effects are explored.It provides theoretical basis and data support for IGBT chip heat sink structure design and optimal operating parameters.