Research And Design On Precision Detecting System Of Headplate Packaging Based On Computer Vision

With the development of the semiconductor production industry, many new techniques on semiconductor packaging are coming forth. The requirments for the precision production become higher and higer. The traditional detecting method on semicondutor packaging could not satisfy the higher precision of the new packaging techniques. Now the computer vision inspecting system has a great help to promote the automatization of the semiconductor production system, and is used widely in this field.In this paper, the inspecting system based on computer vision techniques is designed to inspect the packaging precision of a new type headplate. And the structure and theory of the machine vision have been discussed. Modularized method is proposed.In the hardware system, a high precision 2-D platform has been used to build the carrier, with the control of computer and SCM. The system could acquire images of sample at any beginning position, and if only the parameters of image have been set properly, the system could automatically inspect the headplate packaging.An adaptive morphological filter based on 2-D image entropy is used to preprocess the original images. The high precision image mosaic based on the image grayscale curve is realized. The image grayscale weight reconstruction method based on the pixel area distribution characters improve the image quality and the inspecting precision. Thus the detecting system precision is just depended on the computer vision system but not on the mechanical system.The design has improved on the basis of originally design and traditional vision , the high precision can reach 0.1μm at most.