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LPCVD Fabrication Of A-Si1-xCx:H Thin Films And Its Structural Characterizations

Posted on:2007-11-21Degree:MasterType:Thesis
Country:ChinaCandidate:H B JianFull Text:PDF
GTID:2178360182485684Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
Hydrogenated amorphous silicon carbide films (a-Si1-xCx:H) have been successfullydeposited on Si(100) surface by low pressure chemical vapor deposition (LPCVD) with CH4and SiH4 as reaction gases. The effects of deposited parameters on the films growth rate arestudied. Fourier transform infrared spectroscopy (FTIR),X-ray photoelectron spectroscopy(XPS),scanning electronic microscopy (SEM),atomic force microscopy (AFM) and X-raydiffraction (XRD) are employed to analyze the compositions and structural characterizationsof as-deposited films,and the growth mechanisms of a-Si1-xCx:H are also discussed. Theresults indicate that the substrate temperature and reactive gas rates ([CH4]/[SiH4]) play a keyrole in the composition and structure of a-Si1-xCx:H films. The transformations fromamorphous structure to nanostructure are achieved by optimization of the depositedparameters. The dependence of annealing temperature and annealing time on the conductanceof as-deposited films are also studied. The results show that the electrical resistivity is relatedto the activation and concentration of B,crystallization and structures of films.
Keywords/Search Tags:low pressure chemical vapor deposition (LPCVD), hydrogenated amorphous silicon carbide films (a-Si1-xCx:H), nanometer-grains, thermal annealing, B doping, electrical resistivity
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