Numerical Simulation And Optimization Of Pick-up Process For Die Bonders

In semiconductor packaging industries, the pick-up process of die bonder is very important, how to realize the high stability, high quality and efficient coordination of pick-up process parameters is an important subject. At present, there are so many in-depth researches about pick-up process parameters and designs of precise mechanisms which are realized in abroad and they make the consensus between parameters sensitivity and importance arrangement. Because the related technical started later in domestic, the key technologies are blockaded by foreign countries and lack of related data accumulation, it is necessary to study pick-up process parameters. The quality impact factors and mechanism of the pick-up process, the coupling relationship between the parameters, and their disturbance were analyzed and discussed in this thesis, then the optimization of parameters wre realized.According to pick-up process, the finite element analysis method was used in this study by dynamic and static analysis, at the same time, the taguchi methods was used to establish orthogonal array to analysis the parameters interactions, the acceleration teses were used to establish the mathematic model of the system to explore the process parameters dynamic effects, the motion characteristics of the ejection mechanism to was analyzed by establishing optimal objective function, the genetic algorithm was used to selecte the optimal needle speed value which is under constraint conditions in this thesis.Through in-depth research, the ejecting speed, ejecting height, vacuum pressure and press force strength were realized the most important factors in pick-up process. It is important to realize the high stability, high quality and efficient coordination of pick-up process parameters. The peeling phenomenon of tape was analysed by take tie-break contact model. The mathematic model of the system was established by acceleration test. The strength of the damage effect can be simulated by velocity measurement, it needs to make rational selection by genetic algorithm under constraint conditions, then the optimal needle speed value can be slected, and the reliability of adhesive technology was enhanced, die breakage rate was decreased, the productivity was improved. In addition, it can also be maken corresponding optimization on different pick-up machine through this method, established reliable principle on multi-factor influence, dynamic and real-time model of pick-up process for further research.