Optimization Of Circuit Heat Distribution Based On Improved Ant Colony Genetic Algorithm

With the rapid development of electronic technology,circuits and chips are developing in the direction of miniaturization in size,complexity in function and high density.Usually the working conditions of electronic circuits are determined constant while their integration is getting higher and higher,and the heat generation density is also increasing,which leads to the increase of heat generation per unit volume,the relative reduction of heat dissipation area and the increase of thermal resistance.Therefore,the overheating problem of chips,high heat-generating components and thermally sensitive components has become a current research hotspot in the field of integrated circuit design automation.Therefore,it is necessary to optimize the thermal layout of each component when the heat generation area of the component is fixed and the working condition is determined,and it is of great practical significance to improve the reliability of the component.Heat distribution optimization of circuit chips is a consistent practice in circuit thermal design,although many electronic products have been optimized in the development process of thermal layout,and the results are better than the initial random layout,but there are some problems associated with the optimization results,such as: in the process of heat distribution The optimization process is not supported by a large amount of relevant calculation data,so it is impossible to judge whether the optimized result is the optimal result of thermal layout;and it takes a lot of time and resources to repeat the debugging manually several times.In order to further improve the accuracy and efficiency of thermal layout optimization,this paper uses an optimization algorithm based on an improved ant colony-genetic algorithm to achieve an efficient,accurate,and automatic search for the optimal location layout of the thermal effect of board-level circuit chips.The main work is as follows.(1)To understand the research background of circuit heat distribution optimization,briefly describe the necessity of circuit heat distribution optimization,review the current status of research in related fields,and address the inability of circuit heat distribution optimization to(1)To understand the research background of circuit heat distribution optimization,briefly discuss the necessity of circuit heat distribution optimization,review the status of research in related fields,and address the problem that circuit heat distribution optimization cannot achieve the optimal location of the chip automatically,and there is no relevant data as the basis for optimization in the process of heat distribution optimization,and propose to use the global chip heat distribution optimization method to find the optimal location of the chip heat effect and heat distribution as the subsequent im Then,an improved ant colony-genetic algorithm is used to improve the efficiency of heat distribution optimization as the general idea of circuit heat distribution optimization.The general idea of the optimization study is then adopted.(2)Based on the theoretical basis related to heat transfer,numerical heat transfer and fluid dynamics,a mathematical model of steady-state discrete heat distribution is established;the SIMPLE algorithm is used to solve for the velocity and pressure of the flow field and the heat distribution of the circuit chip.The optimal thermal distribution of the chip is obtained by traversing the global solution,and the data is analyzed in Matlab to obtain the thermal distribution cloud map.Therefore,it is decided to carry out the research on heat distribution optimization with improved ant colony-genetic algorithm by traversing the global chip heat distribution optimization results.(3)The basic theories of ant colony algorithm and genetic algorithm are discussed,their advantages and disadvantages are analyzed,and the advantages are combined to form the improved ant colony-genetic algorithm.The improved ACOG is used to solve the heat distribution optimization problem of circuit chips,and the results of the global heat distribution optimization are compared,and it is concluded that the computational stability of the algorithm is relatively poor,and the optimal heat distribution location of the chip However,the impact of this deviation will gradually become negligible with the refinement of the grid division;the computational efficiency of the algorithm is much better than the global traversal method.(4)In order to verify the accuracy of the improved ACOG chip heat distribution optimization and location ranking results,the Ansys Icepak thermal simulation model before heat distribution optimization is established,and the chip ranking results according to the improved ACOG-Ansys Icepak thermal simulation model was established after the optimization of the chip location by the genetic algorithm,and the thermal simulation results before and after the heat distribution optimization by Ansys Icepak were compared with the thermal simulation results after the heat distribution optimization by the improved Ansys genetic algorithm.distribution optimization to verify the correctness of the improved ACS-GA.