Research On Key Process Of New Type LED Array

Based on the innovative design of the structure of light emitting diode array, this paper begins with structural design and layout design. Then it gives the experimental program, according to which this paper discusses the feasibility of the new type array structure. After that, it achieves electrical isolation among each LED p-type mesa, at the same time makes LED matrix units in the same substrate. Isolation Grooves with great depth-to-width ratio are etched to isolate the row of n-type mesas and achieves electrical isolation. And then it tells the detail implement of the device under flip chip conditions. Finally, under inapplicable flip chip conditions this paper attempts to study the realization of medium bridge acrossing isolation grooves. This paper presents several schemes of medium bridge manufacture, and analyzes the difficulty and feasibility of each program.The results show that both realization methods have its feasibility. The flip-chip method can not only reduce dimensions, save costs, but also make improvement in heat dissipation, luminous efficiency and homogeneity. The inapplicable flip chip method also gives a variety of medium bridge production programs. The technology can be applied to micro display devices, and can be extended to detectors.