Numerical Simulation And Experimental Study On Heat Pipe Radiator For Electronic Element

With the increasing of electronic element integration, the problem of heat dispersion has become one of restrict factor in the development of electron technology. To meet the demond of rapidly increased thermal dispersion , numerical simulation and experimental study on heat pipe radiator for electronic element has been made in the paper.According to the working condition of electronic element, a testing system established to test the temperature variety of the electronic element surface on several kinds of radiator which designed on different structure under different working condition.On the basic of the experimental results, integrated theoretical model established which include three part:heat simulation copper block, two-phase closed thermosyphon and heat sink. Contrast the results of numerical analysis and experimental study, fine agreement exists between the numerical prediction and experimental results which proved the rationality of theoretical model.After the rationality of theoretical model has been testified , going along a series of numerical simulation and find the best ratio of evaporation segment and condensation segment by means of analyse the temperature variety of the electronic element surface on the effect of the radiator structure change.A series of strenthen step about heat transfer put forward theoretically by means of numerical analysis focuse on the thermal resistant of each tache of the heat transfer.