Study On The Coupling Packaging Theory And The Key Techniques For Arrayed Waveguide Devices

Arrayed waveguide devices are the foundations of the next generation optical fiber communication technology development, which have bright and wide application prospects. These arrayed waveguide chips, similar in many ways to their electronic counterparts, are fabricated using wafer-level processing techniques and use optical waveguides to route photons, the same way that metal traces are used to route electrons in an electronic chip. These devices include optical beam splitters/combiners for branching/combining optical signals, optical switchers for changing optical paths, optical filtering for introducing multiple optical channels into a single optical fiber, and so on. These devices have many features, such as compact structure, strong noise immunity, excellent property, and easy automation production, which are the developing frontiers of optoelectronic devices at present. Arrayed waveguide devices are rich in theirs categories and structures. With the rapid increasing demands for the quality devices of optical fiber communication system, many problems about mechanisms and rules of manufacturing process for arrayed waveguide devices packaging must be investigated more profoundly, in order to make a breakthrough in the manufacturing technologies, processes and equipment of arrayed waveguide devices.This dissertation focused on the aligning coupling and bonding of arrayed waveguide devices packaging. To address the problems about aligning coupling, the light-wave transmission and aberrance rules on the coupling interface, automatic aligning process and aligning algorithms, residual stress and micro displacement, and equipment integration are studied systematically by theoretical analysis, experimental study and finite element analysis, the syncretic models and numerical-value rules between light-wave transmission and structure parameters, aligning precision and technologic parameters of arrayed waveguide device are established. The automated packaging equipment for arrayed waveguide devices is realized. It can raise the level of the arrayed waveguide devices automation manufacturing. The main research contents and results are listed as follows:(1) The aligning coupling and light-wave transmission on the coupling interface of arrayed waveguide device are researched. The aligning coupling model between waveguide chip and single mode fiber is established based on the waveguide optics theory. The influence rule of the mode field distribution and coupling loss has been analyzed and discussed; meanwhile the experimental verification has been adopted. Base on the Fresnel principle, the light-wave transmission model of waveguide chip and single mode fiber is established. The theoretical analyses of light-wave transmission behavior and test results are given.(2) Aiming at the aligning coupling process, the5RS techniques for arrayed waveguide devices packaging are put forward, which are real6freedom controllability, real parallelism controllability, real seamless coupling, real gap controllability and real performance controllability. Aiming at the disadvantages of climbing algorithm, such as much more sampling points and time consuming are used in aligning. The mode field distribution of waveguide chip and single mode fiber, the motion characteristics and the relation between aligning error and optical power coupling loss are comprehensively considered. The aligning algorithm base on polynomial fitting is put forward. The experimental results verify the rapidness, precision and highly reliability of the proposed approach. The complex algorithm of virtual pivot, polynomial fitting is adopted to align multi-channels; the experimental results indicate that the complex algorithm can align rapidly and effectively. The principle and method of optical channel balance are discussed, and the experimental results are given.(3) Aiming at the generation and controlling technology of arrayed waveguide devices micro-displacement, base on the surface physical chemistry theory, the wetting rule of curing adhesive in the alignment of arrayed waveguide devices is analyzed and discussed. Base on the finite element method, the micro-displacement mechanism and residual stress of arrayed waveguide devices in curing layer is analyzed and discussed. Aiming at micro-displacement, the mechanism by curing adhesive contraction and thermal effect is analyzed and discussed, and the impact towards optical performance. The theoretical model and designing method of consolidation of strength and stiffness distribution is established, and the method of consolidation of strength and stiffness is developed for the technology of curing adhesive.(4) Aiming at the automated packaging equipment for arrayed waveguide devices, base on the theory of multi-body system dynamics, the accuracy transfer model of aligning and coupling is established. The basic principles of sensitive error source, error compensation and computation of the value of error compensation are analyzed and discussed. According to the automated alignment requirements of waveguide chip and fiber array, the machine visual system of measurement and adjustment of waveguide chip and fiber array is established, the linear measurement technology of image preprocessing and grading rapid Hough Transform is proposed, and the curing system of adhesive and UV is established. Summarization above the technologies of each unit mentioned, the arrayed waveguide devices automated packaging equipment is realized, and the automated packaging process software is developed.(5) Comprehensive utilization of the research results mentioned above,1×8,1×16and1×32planar optical waveguide splitter are taken as examples, a lot of packaging experiments are taken, and the performance of device is measured. The results indicate that the optical power loss of single point lower than0.1dB, the wavelength dependent loss lower than0.2dB, the uniformity lower than0.2dB, the polarization dependent loss lower than0.15dB, and the temperature dependent loss lower than0.22dB, which indicates that the arrayed waveguide devices base on automated packaging equipment and processing mechanism of the subject are better than other commercial devices apparently, and reflects that the subject has many technical advantages and practical engineering adaptability.