Arrayed Waveguide Device Packaging Consolidation Properties

Array waveguide devices are used widely in optical communication networks for their compact structure, anti-interference, and good consistency. At present, the packing restrict the development of array waveguide devices, and the performance of packaging is decided largely by the adhesive characteristics of devices. Therefore, the analysis to the adhesive characteristics of array waveguide devices is great significance.Through modeling to the adhesion status of 8-channel array-fiber module, based on the finite element method, the distribution of stress and micro-displacement were computed under the condition of the temperature shock related to the standard of Bellcore GB-1209/1221, and stress-photo-elastic effect was used to calculate the distribution of index of refraction induced by the thermal stress. The results show that the best performance was found in the situation about array-fibers with zero offset position of fiber.Through modeling to the adhesion status of array waveguide devices bonding, based on the finite element method, the distribution of stress and micro-displacement was also computed under the condition of the temperature change; and the photo-elastic effect and the beam propagation method was used to analyze the birefringence effect induced by stress and the optical loss caused by the micro-displacement. The conclusion show that the greater the thickness of adhesive, the larger micro-displacement produced by thermal expansion, and then, leading to higher optical power loss; If the additional loss is less than 0.15dB standard inspection, the adhesive thickness must be requested within 16μm.The experiment about moire interferometer to measure the micro-strain of the end of array-fiber was tested in the situation of the temperature change from 95℃to 21℃. With the contrast of the experimental results, the finite element calculation results were done at same temperature conditions. It shows that strain results of simulations and the strain results of moire interferometer test are basically in agreement, so the finite element method is reasonable and accuracy for simulating the adhesive situation of array waveguide devices.