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Research On Integrated Miniaturized RF Power Dividers And Packaging Technology

Posted on:2024-01-04Degree:MasterType:Thesis
Country:ChinaCandidate:D S F GaoFull Text:PDF
GTID:2568307136493714Subject:Electronic information
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Miniaturization and integration are the development trends of radio frequency devices.Integrated Passive Device(IPD)technology enables the design of passive devices with extremely small size.At the same time,packaging is more required by high-density integrated circuits to ensure a reliable working environment,and the transmission of internal signals in the package is one of the focuses of packaging research.Therefore,this thesis studies the miniaturized power dividers based on Ga As-IPD technology,packaging and signal transmission.The main works and innovations are as follows:1.A power divider circuit structure with low-pass filter response and two transmission zeros is proposed.Using advanced Ga As-IPD technology,a miniaturized power divider based on lumped parameter elements is designed.The working frequency range is 8~12GHz,and the isolation is better than 20d B.It has a small size of 0.80mm×0.76mm(0.0960×0.0910).2.A small package module suitable for filter power amplifier is designed.Wire bonding,coplanar waveguide with ground(CPWG)to stripline interconnects,and stripline-to-stripline vertical interconnects are studied in depth.The overall packaging structure is designed and processed,and the built-in filter power amplifier component is tested and the expected filter response and gain are obtained.It is verified that the designed package can make the filter power amplifier component work normally.The overall integrated package module is small in size of9.0mm×7.0mm×1.4mm.3.A small package integrated module suitable for the proposed miniaturized power divider is designed.On the basis of the above-mentioned packaging module,a three-port packaging module is improved and designed,and the internal layout of the packaging is compact.Finally,the proposed power divider is embedded in the package for verification.The performance of the packaged power divider can still maintain good consistency in the passband.The overall integrated package power divider is small in size of 4.3mm×3.6mm×1.4mm.
Keywords/Search Tags:Power Dividers, IPD, Vertical Interconnection, Miniaturization
PDF Full Text Request
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