Research On Direct Writing Metal Matrix Composite Conductive Structure Based On Interfacial Reaction And Its Performance Application

Metal-based flexible circuits are widely used in various flexible electronic devices due to their excellent electrical conductivity and excellent mechanical properties.Traditional methods of preparing flexible metal circuits such as photolithography and electroless deposition have significant technical cost requirements,poor mechanical bending resistance of finished products,and easy to fall off from the substrate.Fast and easy mass industrial manufacturing is the result of conforming to the trend of economic development,and the use of mature direct writing printing process to manufacture metal-based flexible circuits has broad application potential.In this work,a metal/polymer composite conductive structure with high conductivity and excellent bending resistance was successfully prepared by direct writing printing based on interfacial reaction.The main research contents are as follows:（1）Using the blending method,the water-soluble polymer polyvinyl alcohol and the silver precursor silver nitrate are mixed in one pot to prepare a polymer/metal precursor composite ink,which can be obtained on different flexible substrates by direct writing printing.Precursor patterns of different degrees of fineness,after the printed pattern is cured,by reasonably adjusting the conditions of the interface reaction,a silver nanoparticle conductive layer with a resistivity as low as 10^-6Ω*m can be obtained on the surface of the pattern.Due to the ionic coupling force between the hydroxyl group and the silver nanoparticles,the metal conductive layer is still stably adhered to the surface of the pattern even after 10,000 times of bending,and the resistance of the circuit does not change by more than 20%.This research result is of great significance for the facile and low-cost fabrication of flexible metal-based circuits.（2）By adjusting the printing and curing conditions of the direct writing polymer/metal precursor composite ink pattern,the coffee ring effect can be used to control the printed pattern structure,and the special silver nanoparticle structure can be obtained by using the interface reaction.This non-lithographic approach will further enhance current fabrication methods to create imaged structures in a simple and economical manner and holds great potential.This research has important implications for enhancing current methods for constructing metal nanoparticle patterned surfaces.（3）By changing the preparation process of the polymer/metal precursor composite ink,adding acrylamide with rich hydrophilic amide groups to obtain a new type of functional composite ink,after printing,it can be assisted by ultraviolet light and interfacial reaction to obtain dual The cross-linked polymer network/metal conductive layer composite structure,due to the presence of abundant hydrophilic groups,could absorb water molecules in the environment to change the volume of the composite structure in a humid environment,thereby affecting the resistance of the surface metal conductive layer and generating electricity.Signal response.This research result is of great significance for the application of abundant polymer/metal precursor composite inks and the low-cost and rapid fabrication of flexible humidity sensing devices.In summary,based on the interface reaction direct writing polymer/metal composite structure,this research could obtain a silver nanoparticle conductive layer with high conductivity and bending resistance at room temperature,which eliminates redundant steps such as sintering,and is low cost.The facile fabrication of flexible metal circuits at low cost provides a good strategy and at the same time expands its application range.