| The Micro light-emitting diode(Micro-LED)is the intersection of integrated circuit,display and discrete semiconductor device industries.The Micro-LED display has the advantages of self-illumination,high efficiency,low power consumption,high integration and high stability,and is called the "next generation display technology",or even the " ultimate display technology".There are still many technical problems to be overcome to realize the industrialization of Micro-LED.The industry generally believes that mass transfer technology is one of the key technologies restricting the rapid development of Micro-LED display.In order to further study the application details of mass transfer technology in the fabrication of Micro-LED display devices,this paper used related processes to fabricate a bump transfer module with size of 30 μm x 50 μm,bump pitch of 126.9μm,and a corresponding pixel density of 200 PPI(Pixel Per Inch).The transfer module was used to transfer Micro-LED.The research content of this paper mainly includes three parts:1.The different types of display technologies,the key technologies of Micro-LED display and the research status of Micro-LED at home and abroad were introduced.At the same time,this paper introduced several mass transfer technical solutions in the industry,and expounds the technical principles,advantages and disadvantages of each solution in detail.2.The development background of transfer module was expounded,and the optimal scheme of transfer module structure and material was compared and determined.Transfer templates were made on a 4-inch silicon wafer using lithography and dry etching.3.A bump PDMS transfer module was fabricated by nanoimprinting device and characterized.And this transfer module was used to successfully transfer the three-color Micro-LED to the drive backplane,with a transfer yield above 99.9%.The self-made high quality transfer module can be used to replace imported materials,which has a positive effect on the development of domestic Micro-LED mass transfer. |
