Analysis Of Circuit Impact Failure Mechanism And Research On Protection Method Of Hard Target Penetration Fuz

In order to improve the survivability of the hard target penetration fuze in the process of high overload penetration,the development of an impact-resistant,highreliability penetration fuze has important military significance.This paper mainly studies the failure mode and failure mechanism of the hard target penetration fuze under high-impact overload,and conducts theoretical research and simulation analysis.Based on the theory of fuze circuit component buffer protection,the impact of cushioning vibration isolation materials and potting reinforcement materials on fuze overload is studied and optimized Buffer plan to verify the feasibility of the plan.Aiming at the problem of fuze circuit component failure during the hard target penetration process,the fuze circuit and typical components are selected as the research object,the main factors of fuze circuit component failure are analyzed,and the fuze circuit system,information processing chip,memory chip,tantalum capacitor,ceramic capacitor are summarized The main failure modes of acceleration sensors and power supplies under impact.Based on the basic theory of projectile penetration into hard targets,the finite element models of projectile-fuze structure,fuze components,circuits and typical devices are established respectively,the dynamic response of the fuze during the penetration process is analyzed,and the transient impact process of the fuze body and circuit board is studied.Combining the numerical simulation results,carry out the impact test experiment of the fuze circuit and components,and use the high-speed photography system and the fuze tomography equipment to improve the research method.The failure mode of the test circuit during the impact process is summarized as follows: When an impact overload below 32000 g is applied,the main failure mode of the circuit board is that the circuit board deforms and causes the components to fall off;The greater the impact overload,the greater the bending and deformation of the circuit board,and the more components fall off;The fall-off of components is related to the volume and quality of electronic components.The larger the package,the easier it is to fall off;the fall-off components are mostly distributed on the edge of the circuit board and near the via holes.Place the packaged components at the edges and via holes.Aiming at the failure mode of the fuze circuit and typical components during the penetration process,based on the buffer protection mechanism under high impact overload,the stress wave transmission and attenuation mechanism between different media is analyzed,and the elastic buffer material of the projectile-guide structure is established for the hard target.The dynamic model of the penetration process,to study the transient impact process of the fuze body and the circuit board.The buffering and vibration isolation materials and circuit reinforcement methods of the fuze components are selected as the research objects,and rubber is proposed as the overall buffering and vibration isolation materials of the fuze,and the epoxy resin/PDMS composite potting strengthens the protection plan of the fuze circuit,which effectively attenuates the peak impact and overload,which is obvious To reduce the signal oscillation in the impact process,the feasibility of the scheme is verified through simulation analysis and experimental test comparison.