Font Size: a A A

High Power Semiconductor Lasers With High Density Thermal Optimization Study Of Conductive Package Structure

Posted on:2024-08-09Degree:MasterType:Thesis
Country:ChinaCandidate:R ZhaoFull Text:PDF
GTID:2530307157993639Subject:Optical Engineering
Abstract/Summary:
With the development of high-power laser pump applications,semiconductor lasers stand out as high-quality pump sources that can achieve high-power and high brightness.Due to the advantages of compact structure and large output power of Dabbar semiconductor laser,Dabbar semiconductor lasers have become the mainstream of high-power pump source.Due to the small glowing point of the Pakistani laser,the SMILE effect occurs due to the limitation of the heating string,which seriously reduces the quality of the laser pump.For multi-single-tube semiconductor laser,single-tube semiconductor laser beam quality and flexible structural design,without the need for complex plastic surgery to achieve small high-power pumps.Therefore,in order to promote the development of laser pumping of semiconductor lasers,how to innovate and optimize the packaging structure of multi-single-single-tube semiconductor lasers is very important and practical.This article introduces the current status of domestic and foreign research in semiconductor laser packaging and heat dissipation technology,pointing out that temperature affects some characteristics of semiconductor laser.According to the internal heat transfer theory and beam plastic surgery technology inside the semiconductor laser,the designed multi-tube stack packaging structure is used to optimize the heating characteristics of the multi-single stack packaging structure and the space beam simulation.A reliability analysis is provided for the design of the semiconductor laser pump under high density packaging.(1)Design a high-density packaging structure of multi-single-tube laser stacking discharge.Through ANSYS Workbench analysis software,the 4 single-tube laser under the packaging simulates and optimizes the heat behavior.Optimization shows that the maximum hot resistance between adjacent single tubes is reduced from 0.23 k/w to 0.11 k/w,and the effects of thermal bandwing will be reduced by nearly 50%.The optimized structure of the after-optimized structure is beam plastic surgery through the ZEMAX software.The design shows that through plastic surgery,four monocular beams can be combined into a uniform rectangular pump light.The overall design of the structure has reasonably improved the hot-stringing effect of high-density packaging,and achieves high-quality uniform pump light in the smaller plastic space module.(2)Design a high-density packaging structure based on microchannel heat sink packaging with multi-tube laser stacking arrangement.ANSYS workbench finite element analysis software was used to simulate and optimize the thermal behavior of six single-tube lasers in this package.The optimization shows that by changing the internal fin structure and water flow rate of the microchannel,the fluid flow can be adjusted to promote the mixed flow effect and improve the heat dissipation performance of the microchannel.The optimized structure is fiber-coupled using ZEMAX software.The design shows that six single tubes can be coupled into a fiber with a numerical aperture of 0.22 and a core diameter of 200 um,and the coupling efficiency is 95.5%.Under the premise of low cooling power consumption required for microchannel heat sinking,more single-tube semiconductor lasers are packaged in a limited space to provide high-power pump light.
Keywords/Search Tags:semiconductor lasers, finite element analysis, thermal characteristics, Package structure, microchannels, Beam shaping
Related items