Research On MMIC Co-design Method And Reliability Evaluation Technology Based On Multiphysics Field

With the continuous development of technologies in the related fields of integrated circuits,the performance of integrated circuits such as MMIC continues to improve,and the packaging continues to develop towards miniaturization and integration.At the same time,more and more reliability problems have also occurred,resulting in huge economic loss,Therefore,the reliability of MMIC has gradually become the focus of research.In addition,MMIC design involves the co-simulation and optimization of multiple physical field quantities,which requires co-simulation of multiple commercial EDA software.However,the mutual data transfer between the software is usually realized manually,which is inefficient and error-prone.Therefore,to quickly realize co-simulation optimization and obtain the global optimal parameters of chip design,it is urgent to design a "Circuit-Electromagnetic-Thermal-Force" collaborative design and simulation platform based on commercial EDA software,Realize the data input and output of each EDA software and the automatic simulation and optimization of multi-physical field quantities.Therefore,the MMIC collaborative design method and reliability evaluation technology of the multi-physics field has very important research value.The main research work of this thesis is as follows:1.Based on MATLAB,this thesis establishes the input and output interfaces of four software: ADS,HFSS,ANSYS,and SOLIDWORKS,which realizes the functions of model establishment,parameter modification,execution simulation,post-processing,etc.,and the models can interact with each other in HFSS,ANSYS,and SOLIDWORKS to achieve efficient modeling.Based on this,a multi-physical field design and simulation platform was established,which realized multi-physical field co-simulation and optimization and reduces workload.2.Based on the multi-physical field design and simulation platform established in this thesis,the simulation and optimization of the 2.4 GHz watt-level rectifier circuit have been completed.The consistency between the simulation results and the actual test results proves the effectiveness of the platform;based on this platform,the electromagnetic characteristics simulation of the 5-watt RDSS power amplifier chip was completed,and the simulation results were compared with those obtained by traditional methods based on HFSS and ADS Momentum,which further verified the effectiveness and feasibility of the platform.3.The steady-state thermal simulation and steady-state statics simulation of the 5-watt RDSS power amplifier chip were carried out using the multi-physics quantity design and simulation platform.And use the idea of zoning to realize the drawing of temperature cloud map and temperature contour map;Based on the data obtained from steady-state thermal simulation and steady-state statics simulation,the reliability evaluation model of the 5-watt RDSS power amplifier chip was established,and the life prediction was realized;At the same time,the thermal resistance network of the 5-watt RDSS power amplifier chip is established,and the calculation results of the junction temperature are compared with the results of the finite element simulation,and the rapid prediction of the junction temperature is realized.The research results of this thesis provide a novel solution for the collaborative simulation of multi-physical field quantities,help promote the development of MMIC collaborative design technology,and lay a foundation for engineering applications for MMIC reliability research.