| Micro-transfer printing technology has important applications in flexible electronics and device miniaturization.With the micro-transfer printing technology,precise assembly among various micro-components constructs composite micro-structures or high-performance electronic systems.Micro-transfer printing technology breaks away from the constraints of process incompatibility in traditional ways by highly integrating high-performance discrete devices,and has the virtues of high integration,easy operation,low cost,and controllable yield.Based on the thin film bulk acoustic resonator(FBAR),this article studies the applications of micro-transfer printing technology in flexible packging and infrared sensing,and monolithic heterogeneous integration.The main research contents and achievements of this work are as follows:1.In the aspect of micro-transfer printing technology,combining the principle of fracture mechanics,original process has been optimized.The introduction of bonding solution and the reduction of the duty cycle of the anchors reduce the process complexity and improve structural robustness after transferring;2.Based on micro-transfer printing technology,for the first time,an air-gap type FBAR flexible packaging scheme for infrared sensing is proposed.And the reliability test of the packaging scheme is completed,and the packaged devices show good mechanical flexibility.Near-infared sensing tests show that the device has a responsivity of 3.31 Hz/n W,a noise equuuivalent power of1.28×10-8 W/Hz1/2,and a mormalized detectivity of 5522 m·Hz1/2/W to 785nm near-infrared light;3.Based on micro-transfer printing technology,we have realized a 3D stacked monolithic integration of FBAR film and CMOS integrated chip for the first time,and explored a complete set of implementation schemes.The integrated oscillator outputs an oscillating power of-17.2 d Bm at 2024 MHz,and a phase noise of-136 dBc/Hz at far-from-carrier frequency offset. |
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