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Research On Key Technologies Of E-band Integrated Receiving Components

Posted on:2021-03-12Degree:MasterType:Thesis
Country:ChinaCandidate:P LiFull Text:PDF
GTID:2518306512986919Subject:Electronics and Communications Engineering
Abstract/Summary:PDF Full Text Request
With the state attaching great importance to the wireless communication system and radar business,millimeter wave applications have also developed rapidly.The research of millimeter wave miniaturized receivers has gradually attached people's attention.Nowadays,how to achieve miniaturization,planarization,integration,and low loss are the main directions of research.This paper aims at miniaturization,planarization,integration and completes the design of the miniaturized receiver in the E-band based on MCM(multi-chip module)technology.Firstly,this article investigates the relevant information of millimeter wave transceiver components at home and abroad.By analyzing and comparing the advantages and disadvantages of different receiver structures,it is determined that the receiver adopts a superheterodyne structure.According to the design requirements,the indicators are detailed and decomposed,and a detailed scheme design is made,including the frequency conversion scheme,the local oscillator link design,and the receiving link design.Then perform link simulation budget for each indicator through ADS.Secondly,the active chip of the millimeter wave miniaturized receiver is selected,and the miniaturized monolithic microwave integrated circuit(MMIC)chips are used.The passive circuit adopts a flat design,which realizes integration and miniaturization.The passive circuit part mainly includes the conversion structure based on H-plane waveguide to microstrip which achieves insertion loss better than-1d B in E-band.A coplanar waveguide CQ-type SIW(substrate integrated waveguide)filter which is used at the RF input end achieves image suppression degree more than 40 d Bc.A gradual CQ-type SIW substrate integrated waveguide filter used on the local oscillator 1 link achieves the rejection to the second harmonic component more than 37 d Bc.After the first down-conversion,a hairpin filter is used to achieve a return loss which is better than-13 d B.At the intermediate frequency output link,a cross-coupled hairpin filter and a multi-layer vertical folded interdigital filter are respectively designed,and the in-band return loss is better than-14 d B and-10 d B,the insertion loss S21 is better than-2d B respectively.However,the length of the multi-layer vertical folded interdigital filter is only 1/4of that of the cross-coupled hairpin filter,which realizes a miniaturized design.Finally,according to the circuit design,this paper completes the overall layout of the receiver,the design of the integrated receiving circuit,the design of the power supply board,and establishes the three-dimensional model of the cavity.The E-band miniaturized receiver is assembled by micro-assembly technology and the receiver performance is tested.The size of the receiver is 35.5mm?20mm?118mm.After performance testing,the whole machine has a gain of 50 d B,the noise figure is less than 7d B,the gain flatness is less than 4d B,and the thirdorder intermodulation value is more than 40 d Bc in the range of 73.4-75.4GHz,the output 1d B compression point is greater than 10 d Bm,which meets the requirements of the target.
Keywords/Search Tags:E-band, miniaturization, receiver, waveguide to microstrip, filter
PDF Full Text Request
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