Analysis Of Electrothermal Characteristics Of Carbon Nano Interconnect Structure

With the exponential development of the electronics industry,integrated circuits are rapidly developing in the direction of miniaturization and high-density integration.While the functions and performance of chips are improved,more rapid and dense interconnections are needed to achieve them.Interconnects are an important part of integrated circuits,but as the integration density increases,the resistance of interconnects will increase as the scale becomes smaller,and the reduction in the line spacing of interconnects will also directly lead to the increase of capacitance.In addition to the introduction of signal delay and crosstalk between lines,the increase in interconnect resistance will also reduce the thermal stability of the system.Therefore,carbon nanomaterials are gradually becoming a hotspot in the application of interconnection structures because of their excellent electrothermal properties.In this paper,based on the physical structure and energy band structure of carbon nanomaterials,electrical models are established for single-walled carbon nanotubes,multi-walled carbon nanotubes and graphene,respectively.And other temperature-dependent parameters such as thermal conductivity and specific heat capacity are carried out by computational extraction.Based on the extracted parameters,a one-dimensional model of single-walled carbon nanotube interconnects was established,the transient heat conduction problem was analyzed,and the single-walled carbon nanotube bundle local interconnects were modeled and simulated.For multi-walled carbon nanotubes,the unique negative temperature coefficient of resistance was modeled and analyzed,and one-dimensional and two-dimensional interconnect models were established respectively.The electrothermal problem under steady state was analyzed and discussed.And the anisotropy of carbon nanotubes was under consideration.For graphene interconnects,the electrical parameters were extracted according to Landauer formula and Boltzmann transport model,and the electro-thermal coupling analysis of the interconnects of multilayer graphene was carried out,and the performance differences between doped multilayer graphene and neutral graphene were compared.Based on the Boltzmann equation,the singular skin effect of multilayer graphene was analyzed and compared with the normal skin effect.Finally,a three-dimensional heterogeneous interconnect structure was established,including horizontal interconnects and vertical TSVs.Based on this model,the electrical and thermal performance between carbon nano interconnects and traditional copper interconnects was compared and analyzed.The modeling research and electrothermal characteristic analysis of this paper have guiding significance for the design of carbon nano-interconnects.