Research On The Scheduling Problem Of Combined Wafer Fabrication Equipment In Semiconductor Processing

Semiconductor manufacturing is one of the most important manufacturing industries in the world.As the core components of industrial equipment,electronic equipment and network communication equipment,the production of semiconductor chips and the progress of its industry play a vital role in national development and scientific and technological progress.China's demand for semiconductor chips is very strong.In 2018,China's consumption of semiconductor chips was 158.4 billion yuan,accounting for about 33.1 percent of the global consumption.In semiconductor wafer manufacturing,modular manufacturing equipment modules often need to work together,and unreasonable scheduling often leads to the waste of system resources.Most of the existing scheduling methods for wafer production have not fully explored and utilized the potential of mechanical arm.This paper attempts to make some attempts in this regard,and studies and discusses the scheduling problem of combined equipment for wafer production with mechanical arm as a temporary buffer.The specific research contents and results are as follows:As for the scheduling problem of dual-arm single-combination wafer manufacturing equipment in the wafer manufacturing process,the scheduling optimization problem of dual-arm combined wafer manufacturing equipment under reentrant and non-reentrant wafer processing modes was studied.To wafer and wafer processing most efficient cycle minimum as the optimization goal,set up the re-entrant wafer processing process microtek round modular manufacturing equipment and processing of mechanical arm cavity of the mathematical model of optimal scheduling,and dispatching method based on Swap manipulator,design a solution to a mechanical arm and between the processing chamber and vacuum lock wafer transfer process of the heuristic algorithm,finally,the use of wafer manufacturing simulation data of calculation,the simulation experiment verifies the method considering the mechanical arm holds a waiting and wafer delay feeding method of double arm combined wafer manufacturing equipment in wafer production,It can effectively improve the wafer yield and shorten the average processing cycle of wafer production.In this paper,the scheduling optimization problem of dual-arm multi-combination wafer manufacturing equipment with holding parts waiting is studied.In this paper,theidea of decomposition is adopted to divide the multi-combination wafer manufacturing equipment into multiple single-combination device scheduling problems,and the time constraint of the buffer in the model is demonstrated.Then,the heuristic algorithm of single modular device is extended to multi-modular device,and the heuristic algorithm of manipulator scheduling wafer transfer process in multi-modular device is obtained.Finally,the simulation results are used to verify the applicability of the method of holding time and the method of delayed wafer feeding in the multi-combination wafer manufacturing equipment.