Structure Optimization Design Of PCB Based On MEMS Inertial Sensor

Based on the full investigation and analysis of the research status of thermal analysis of MEMS-IMU at home and abroad,the main research content of this paper is determined for the influence of temperature change on the thermal deformation of tactical MEMS-IMU during operation.This paper studies the influence of temperature field on the output performance and system reliability of MEMS inertial devices from theoretical derivation,simulation analysis and experimental test,and puts forward corresponding improvement measures for the existing structure.(1)This paper introduces the basic working principle of MEMS-IMU and the developed prototype of MEMS-IMU,and analyzes the error sources of MEMS-IMU in the integration process to determine the breakthrough of this research direction.This paper introduces the theoretical basis of heat transfer,thermal stress and finite element calculation,qualitatively analyzes the source of thermal stress,and puts forward a method of combining theoretical analysis,numerical calculation and experiment to solve the temperature field;(2)The single sensor PCB model is established,the model is simplified and the theoretical solution is carried out.Combined with the theoretical analysis,the simulation method of distributed simulation iterative analysis is proposed.The temperature field distribution and heating time of PCB are obtained through the finite element analysis.The correctness of the finite element simulation scheme is verified by the temperature measurement experiment,which provides the basis for the next thermal stress solution and optimization analysis;(3)The temperature field obtained by the finite element method is used as the boundary condition to simulate and analyze the PCB,and the thermal deformation and equivalent stress of the PCB in the steady state are obtained.The factors influencing the thermal deformation of the PCB are obtained by combining the theoretical analysis,and these factors are analyzed one by one to determine the influence of each factor on the thermal deformation of the PCB;(4)In order to get the optimal structure of PCB under given conditions,the orthogonal analysis is used to get the optimal structure and layout of PCB.Combined with the gray correlation analysis,temperature and thermal deformation are taken as objective functions to get the influence weight of various factors of PCB.Finally,the feasibility of the optimized structure scheme is verified by experiments.