Field-Circuit Cooperative Analysis And Design Of T/R Modules Of Active Phased Array Antenna

The active phased array antenna is different from the traditional form antenna which uses mechanical rotaton.It uses electronic scanning technology to change the antenna beam direction and perform beam scanning.Compared with traditional mechanical scanning antennas,there are a lot of advantages of active phased array antennas:high measurement accuracy and high scanning rate,which can change the antenna beam direction quickly;small size and low failure rate,easy maintenance by replacing the unit;Multi-target tracking and scanning ability is strong.It has been widely used in various weapon systems,has become one of the core components in the field of defense,and has broad application prospects.The Transmitting/Receiving module(T/R module)is used to excite each radiating antenna unit to synthesize beams with specific requirements in space.It is the core component of an active phased array antenna,and it's performance largely determines the Electrical performance of the whole antenna.T/R modules are composed of passive structures and active chips.With the development of active phased array antennas in the direction of high frequency bands,high gain,and high density,the geometric density and heat flux density of T/R modules increase quickly.The mechanical-electrical-thermal coupling effect between passive structure,active circuit and module performance is becoming more and more significant,which becomes a key issue that hinders the improvement of antenna performance.Aiming at this problem,this article systematically carried out the following research.Firstly,a field-circuit collaborative analysis method for T/R modules is proposed.The electromagnetic field analysis of passive structures is used to calculate the equivalent circuit parameters,and the circuit analysis method is used to calculate the overall T/R modules under actual operating conditions.The performance overcomes the problem that the traditional equivalent circuit method cannot analyze the electromechanical coupling effect,and improves the analysis accuracy.Secondly,a field-circuit optimization design method for T/R modules is proposed.Through the collaborative optimization of electromagnetic circuits,the structural parameters are optimized to evaluate the performance of the modules in the heat state to achieve the optimal performance of the modules under service conditions,overcoming the traditional The electromechanical thermal separation design method leads to the defects of many iterations and difficult performance improvement of modules.Finally,according to the needs of the subject,a three-dimensional vertical interconnected X-band T/R module was developed using field-circuit optimization design methods.A field-circuit collaborative model was established for simulation and analysis to verify the rationality of the plan and optimize the overall plan.The size of the T/R module is 15mm×15mm×7.2mm.Compared with the traditional two-dimensional planar structure T/R module,the occupied area is reduced by 15%compared with the two-dimensional structure,receive and transmit channel gains are increased by 10%and 20%,respectively.