Research And Design Of Low Insertion Loss Vertical Interconnection Structure Of W-Band T/R Module

As a key component of a millimeter-wave radar system,the performance of the transceiver(T / R)module largely determines the performance of the radar.Most of the T / R modules currently used in radar systems use planar integration.achieve.The development of integrated circuits and packaging technologies has led to improvements in the direction of miniaturization,low cost,and high integration of T /R module circuits.The multi-layer circuit design can effectively achieve the miniaturization of module circuits.The vertical interconnection structure studied in this paper is the key point to realize the interconnection between layers of multilayer circuits.In the W-band multi-layer circuit in the millimeter wave band,the signal transmission is the same as the low-band circuit,and the plane transmission line is mainly used.However,the vertical interconnection of plane transmission lines between different layers in a millimeter wave multilayer circuit has more serious problems of impedance discontinuity and electromagnetic leakage.Structural design plan.In recent years,the substrate integrated waveguide(SIW)has been widely used in circuit design.According to the investigation,it is found that the use of SIW in multilayer circuits cannot avoid the problem of transition conversion with other transmission lines or vertical interconnection between different layers.There are few research results on the existing SIW vertical interconnection structure between different layers.In high-frequency circuits,SIW can better suppress electromagnetic leakage than planar transmission lines.Therefore,this paper proposes a design scheme of SIW-SIW vertical interconnection structure that uses two coupling methods:direct slotting and through-hole coupling.According to the proposed vertical interconnection structure design plan,the main work carried out in this article is as follows:1.Design of vertical interconnection structure for planar transmission lines.The circuit model of microstrip line-microstrip line vertical interconnection structure is established in HFSS,and the influencing factors in the model are analyzed.Design of vertical interconnection structure of strip line-microstrip line.The circuit model of the stripline-stripline vertical interconnection structure is established,and the design of the stripline-stripline vertical interconnection structure in the six-layer circuit board is completed.The performance parameters of the microstrip line-microstrip line and stripline-stripline vertical interconnection structures designed by the planar transmission line interconnection scheme were simulated.The results show that both vertical interconnection structures can have good performance in the W band Transmission performance,insertion loss is within 0.8d B,and the operating bandwidth of 8-22 GHz is achieved in different circuit board layers,thus proving the feasibility of the planar transmission line vertical interconnection structure scheme in W-band different board circuit.2.Design and verification of SIW-SIW vertical interconnection structure.The SIW and rectangular waveguide equivalent theory is used to calculate the width of the planar SIW structure that can be conducted in the W band,and a structure model is established to verify.The SIW-SIW vertical interconnection structure models of direct slot and through-hole coupling are established respectively,and the influencing factors are analyzed respectively.According to the analysis results,the direct slot coupling and four layers of the four-layer circuit board are completed 6.Design of SIW-SIW vertical interconnection structure with through-hole coupling of six-layer circuit board.Through performance simulation,the designed SIW-SIW vertical interconnect structure can achieve insertion loss within 0.4d B,and has an operating bandwidth of more than 10 GHz,which proves the feasibility of two SIW-SIW vertical interconnect structure solutions.3.Design and simulation analysis of vertical interconnect test pieces.The design scheme of the test piece for the vertical interconnection structure was formulated,and the design of the waveguide microstrip probe structure and the microstrip-SIW transition structure in the scheme was completed.The insertion loss of both structures was within 0.5d B.The microstrip line-microstrip line vertical interconnection test piece structure is designed,and its insertion loss is within 1d B;the SIW-SIW vertical interconnection test piece structure is designed,and its insertion loss is within 1.5d B,and the corresponding test piece is made territory.The differences and causes of the physical insertion loss test and simulation results of the planar SIW structure are compared and analyzed.In this paper,the research on the vertical interconnection structure can provide some guidance for the design of the W-band multi-layer circuit.The study of the SIW-SIW vertical interconnection structure provides a new design for the verticalinterconnection structure in the multilayer circuit board The idea has important research significance for the application of SIW in multilayer circuit design.