Research On Sound Radiation Characteristics Of Bonded Circular Saw Blade Substrate And Design Of Bonding Process

Diamond circular saw blades are an important tool for cutting and are widely used in typical scenarios such as building construction and building materials production.Since the base of the circular saw blade is a thin plate part with a large diameter-to-thickness ratio,a small clamping diameter ratio,and poor axial rigidity,the cutting process is prone to axial vibration and radiated noise due to excitation by external loads.Practice has shown that the vibration and noise reduction design such as preserving silencer slits and adding silencer holes on the outside of the circular saw blade can reduce the noise generated during the cutting process,but such methods have limited effects.This paper proposes a new type of circular saw blade substrate with a glued structure.By increasing the overall damping of the circular saw blade substrate,the vibration attenuation speed of the circular saw blade is accelerated to suppress vibration.Based on the Lanczos algorithm,the natural modes of the conventional circular saw blade substrate and the new bonded circular saw blade substrate were simulated and analyzed,and modal experiments were carried out to optimize the finite element model parameters.The sawing force experiment was carried out,and the actual sawing excitation that caused the radiation noise was measured,and the surface vibration velocity response of the diamond circular saw blade under the actual sawing excitation was simulated and analyzed by the modal superposition method.The results show that the vibration velocity response in the axial direction of the saw blade substrate is much larger than that in the circumferential and radial directions,and the axial vibration velocity response gradually increases from the inside to the outside along the radial direction;for the saw blade under the same sawing parameter excitation condition The comparison of the axial velocity response values extracted from the same position shows that the velocity response of the bonded circular saw blade substrate is only 40.7%of that of the conventional circular saw blade substrate.Based on Virtual.Lab Acoustics acoustic finite element software,the diamond circular saw blade substrate is subjected to numerical simulation analysis of acoustic radiation under actual sawing load excitation,and the surface vibration velocity response of the circular saw blade substrate is mapped to the acoustic finite element grid using the Maximum Distance algorithm.Based on the finite element method,the radiated sound field characteristics of the diamond saw blade,such as sound pressure,sound power level,and sound field directivity under the excitation of actual sawing,are simulated and analyzed;the results show that the pitch circle of the diamond saw blade matrix mode The area of the peak area of the modal amplitude is much larger than that of the pitch diameter mode,resulting in a large vibration area and a large noise contribution rate.Propose a new type of circular saw blade substrate with a bonded structure and conduct product trial production to develop bonding technology;select high-strength,high-toughness,and high-damping adhesives for circular saw blade substrate bonding experiments to test adhesives with different properties.The performance of performance indicators such as strength and noise reduction performance;and the trial cutting of the trial saw blade substrate for marble stone to test the comprehensive performance of strength and noise reduction performance in actual use conditions.