Research On Key Technologies Of THz SIP

Terahertz technology has the advantages of good penetration,high data capacity and non radiation,which is widely used in medical,biological and safety detection and other related fields.Terahertz system in package(SIP)has become one of the main research fields of terahertz technology because of its miniaturization and high adaptability.There are some reports about terahertz SIP transceiver system abroad,but it is only in its infancy in China.Therefore,the SIP research of terahertz transceiver system in this paper is of great significance to improve the overall performance of terahertz transceiver system,improve the system integration and reduce the cost.In view of this,this paper studies the terahertz SIP related theory,key technology and transceiver system(1)A gold free integrated package structure for monolithic to microstrip probe bonding is designed.In this structure,a single pad and a microstrip are interconnected by a hole structure.The integrated packaging structure effectively avoids the inconsistency of manual assembly in the process of gold wire bonding,and reduces the transition loss of traditional waveguide quartz probe microstrip through gold wire bonding to a single chip.(2)The principle of terahertz transceiver front-end,SIP transceiver system and related key technologies are studied.Combined with the current domestic technology,a terahertz transceiver system based on high temperature co fired ceramics(HTCC)is designed.The RF connector SSMP inner coaxial stripline microstrip line is used for the input and output of intermediate frequency and local oscillator signal transmission of SIP transceiver system,and the high-frequency signal interconnection is realized by slotting quartz microstrip substrate / probe on HTCC material.(3)The HTCC RF microstrip interconnection structure,quartz microstrip substrate/ probe and THz cavity bandpass filter used in THz SIP transceiver system are simulated.The performance of terahertz cavity bandpass filter is verified by the processing test of a separate module.The test results show that the insertion loss is less than 0.25 dB in the196-214.8ghz passband,and the return loss is better than 20 dB;the insertion loss is more than 25 dB in the 216-236 ghz stopband.In this paper,the driver amplifier chip and the frequency doubling chip in SIP system are separately packaged,and the assembly method is studied to test the assembly performance of the chip.(4)The assembly test of 220 GHz frequency doubling transmitting system shows that the maximum output power of 191-219 ghz is 7.5dbm,with an average of 6.5dbm;the assembly test of 220 GHz frequency mixing receiving system shows that the average receiving power of 2-20 ghz is-25 dbm.