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Inline coherent imaging applied to laser micromachining

Posted on:2015-10-25Degree:MasteType:Thesis
University:Queen's University (Canada)Candidate:Ji, YangFull Text:PDF
GTID:2478390017490373Subject:Physics
Abstract/Summary:
Laser processing has the advantage of minimal sample contact and thus little tool wear over time compared to conventional machining. However, this leads to the difficulty of real-time depth monitoring and control. To help understand the process and achieve automation of laser micromachining, a coherent imaging technique adapted from spectral domain optical coherence tomography (SD-OCT) is applied "inline" with a machining laser to monitor the depth changing information. The axial resolution of the inline coherent imaging (ICI) system is 7--8 microm and the acquisition rate is up to 230 kHz. The capture time is as low as 1.5 micros. .;Many laser applications require high scan speed facilitated by scanning optics. The versatility of ICI is also demonstrated in a galvo-telecentric beam delivery system. ICI is used in a process of trench (as long as 10 mm) etching of steel to monitor the intrapulse and interpulse morphology changes as well as the sweep-to-sweep (up to 36 sweeps) depth changes. High scan speed (up to 375 mm/s) trench etching of silicon are also monitored and the parameter space is explored without destructive post-processing.;Motion during imaging capture time (>1.5 micros) may cause contrast degradation. To reduce the motion artifacts, preliminary experiments on stroboscopic ICI based on a kHz pulse repetition rate femtosecond laser are described. By "sampling" the motion of the machining front discretely with a "sampling time" as short as the imaging pulse duration, our results demonstrate that stroboscopic ICI is a promising way to improve the ICI contrast against motion artifacts.;3D laser machining usually requires ultrafast lasers and homogeneous materials. With ICI, a feedback system is developed for 3D sculpture suitable even for heterogeneous materials without any sophisticated material characterization. 3D patterns with sizes up to 1 mm x 1 mm x 0.2 mm are sculpted in bone and wood with a ps UV laser. 3D patterns with sizes up to 6 mm x 6 mm x 2 mm are sculpted in bone with a CW IR laser.
Keywords/Search Tags:Laser, Machining, Coherent imaging, ICI, Inline, Time
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