| The etching requirements for the patterning of submicron linewidths has increased the complexity of new etching configurations that have been designed to meet the stringent process requirements necessary in ULSI circuit fabrication. In this thesis, one particular etching configuration is examined to determine how an approach to extending the lifetime of the widely used rf parallel plate technology has affected the incorporation of lattice damage and contamination. This etching configuration, which is manufactured by Applied Materials... |
