Effect of package resonances on the performance of microstrip and CPW circuits

Effects of a metallic package on the performance of a microstrip or CPW circuit are attributed mainly to enhanced couplings among various circuit portions. Interactions among various circuit portions caused by the fields induced in the package can be expressed in terms of equivalent multiport package networks. The derivation of network models is based on modal expansion of fields inside a rectangular cavity. Once the network models are obtained, they can be inserted into a commercial microwave circuit simulator allowing a circuit designer to include the effect of a package in the circuit simulation. This thesis describes the development of an efficient method (using a network model) for estimating the effect of a rectangular metallic package on the performance of microstrip or CPW circuits housed in the package. The efficiency of method allows to perform repeated simulations in a microwave circuit simulator which can lead to the optimum circuit performance.;Software has been successfully developed based on the Modal Expansion Method (MEM) for computing the network models for package effects. The procedure developed has been verified by comparison with the full-wave electromagnetic simulation results for several simple cases. Several example circuits have been studied using the method developed for computing effects of a metallic package on the circuit performance. Also, experiments have been carried out for measurement of package effects on coupling in simple microstrip and CPW circuits, and results are compared with those obtained from the method developed.