Design and modeling of devices for measuring adhesion in micro electro mechanical systems (MEMS)

Adhesion between micro structures is one of the major causes for device failures in Micro Electro Mechanical Systems (MEMS). In this thesis, MEMS devices are designed to measure adhesion between micro objects. Micro actuators, sensors, springs and objects are designed in a functional MEMS chip for measuring adhesion forces.;The designed chip will be used for gathering adhesion data which are extremely useful for the study and research of adhesion in MEMS technology.;The thesis first presents a theoretical framework to analyze various surface forces that cause adhesion between microstructures. Next, a chip consisting of devices for measuring adhesion forces between micro objects on the chip is designed. Sizes of thermal actuators, sensors, springs and objects are calculated and determined. Finally, actuators were simulated by ANSYS to verify the functionality and reliability of the devices. The simulations show that thermal actuators can generate large deflection and force. The array is shown to be able to couple the forces of the individual actuators.