Integrated Passive Device Based On TGV Technology And Its Application

The development of wireless communication technology has put forward higher requirements for system integration and operational performance,so some advanced packaging technologies have emerged.In the past few years,a heterogeneous 3D integrated packaging technology has developed rapidly.The heterogeneous three-dimensional integrated system has multiple stacks of chips inside and interconnected by through-silicon vias(TSV)in the vertical direction,enabling the system to achieve higher integration,faster operation speed and lower energy consumption.In addition,due to the existence of a variety of passive modules occupying a large amount of substrate area in the communication system,in order to reduce the package size,scholars have proposed a compact on-chip passive device using TSV.However,in the radio frequency range,the silicon substrate has high dielectric loss and high manufacturing cost,which cannot meet the requirements of RF circuit for high quality factor of the device.Therefore,in this paper,glass is used instead of silicon as the substrate material.Compared to silicon,glass has low dielectric loss and high dimensional stability in the RF range,and through-glass vias(TGV)can be fabricated using a low cost panel process without the need for additional electrical isolation.Considering that the on-chip inductor is a key component of microelectronic applications,this paper uses TGV to implement an on-chip 3D inductor,and uses the TGV inductor to design a second-order coupled resonant band-pass filter and a single-order Wilkinson power divider.This paper first analyzes the electrical characteristics of the TGV inductor to verify the superiority of TGV technology.The results show that the inductive density of TGV inductors is comparable to that of silicon-based inductors,but has higher quality factors,and it has a higher inductor density relative to the plane spiral inductors,which fully illustrates the application prospect of TGV in the miniaturization and high performance of RF circuits.After that,the paper further analyzes the influence of various technical parameters on the performance of TGV inductors,which provides a theoretical basis for the design and optimization of TGV inductors.According to the design principle of the lumped band-pass filter,a second-order coupled resonant band-pass filter is designed with TGV inductors and parallel plate capacitors.The center frequency is 2.4GHz and the bandwidth is about 300 MHz.The insertion loss is less than 2.5 d B,the return loss is greater than 15 d B,and the size is 0.56×0.56×0.18mm3.Finally,this paper uses LC impedance matching network to replace the quarter transmission line in the traditional Wilkinson power divider structure,and its working principle is analyzed by the even-mode theory.A single-order Wilkinson power divider is designed using TGV inductors and parallel plate capacitors.The center frequency is 2.95 GHz,the bandwidth is about 300 MHz,the insertion loss is less than 3.5 d B,the return loss is greater than 15 d B,the port isolation is greater than 15 d B,the phase imbalance is less than 1°,and the size is 0.6×1.1×0.18mm3.Due to the superiority of TGV technology,compared with other processes,the lumped band-pass filter and Wilkinson power divider designed based on TGV inductors have higher integration and superior electrical performance.