Preparation And Application Of Extensible Metal Structure On Flexible Substrates

With the advent of an era when wearable electronics and intelligent devices get increasingly prevalent,flexible electronic devices become what could match the requirement for technological advancement due to their excellent flexibility,strong adaptability to the surface environment and other characteristics.As an essential part of various devices,there is a higher requirement for the metal interconnect wires and electrodes to be more flexible and ductile.In this paper,we designed three different structures of metal interconnection wires,which were namely straight line,first-level curve and second-level curve.A simulation was carried out to analyze how the stress was distributed for the three structures,from which the necking positions of various structures were discovered.In order to further confirm this result,metal structures on flexible substrates were prepared by applying intermittent deposition with the assistance of ion beam sputtering system.The results indicated that the maximum elongation of metal wires of the linear structure,first-level curve structure and second-level curve structure was 2%,23% and 24%,respectively.At the maximum elongation,the corresponding resistance change ratio of the three structures was 3.21%,1.54% and 4.21%,respectively.The metal wires with curved structure is capable of withstanding higher levels of tensile strain,which makes it applicable to various working environments where a higher strain is required.It was also discovered that,given the same rate of elongation,the second-level curved wire exhibited a better consistency in resistance than the first-level curved wire.In this sense,this study provides an experimental reference for the further development of flexible electronic devices.In order to further explore the characteristics in the application of metal structures on flexible devices,a flexible interdigital electrode was designed,which could maintain an excellent consistency in various electrical properties when subjected to repeated bending strain.Further with on this flexible interdigital electrode,the PLZT flexible energy harvest device was fabricated,the open-circuit voltage of which could reach up to 5.09 V with the maximum short-circuit current of 54.5nA.As compared to the "sandwich" energy harvest device based on BCTZ nanowires,it delivered a better electrical performance and remarkable flexibility.