Key Manufacturing Technology Of T/R Module

Transmitter and Receiver Module is one of the core components of active phased array radar.Usually,a single antenna array can have thousands of microwave T/R components.Its internal space is small and there are many chips to be welded,so it is difficult to manufacture.Aiming at the bottleneck problem in the production of T/R components and improving the feasibility of the production of T/R components in engineering batch production,this paper puts forward the research scheme of key manufacturing technology of T/R components.Firstly,the metallization technology of substrate electrode region is studied in this paper.It is found that Pd layer in Ni/Pd/Au film can eliminate the defects of Ni/Au interface caused by nickel corrosion.After high temperature baking,Ni/Pd/Au film exhibits better wetting performance and thermal stability than Ni/Au film,and the optimum thickness of Pd layer is 0.5?m,which can meet the requirements of lead bonding process and brazing process.Secondly,the technology of large area welding of substrate is studied.Capillary channel is formed by subtraction method on the surface of substrates,and large area welding of substrate and shell is carried out by steam phase reflow welding.It can realize the penetration rate of above 90% after X-ray photography,and effectively reduce the existence of voids.Finally,the technology of multi-chip vacuum eutectic welding is studied.The multi-function chip positioning fixture structure and chip positioning module are designed with concave cavity and positioning step structure,and the lead free solder is used to complete the chip eutectic welding.The penetration rate of the chip is over 88%,the shear strength is more than 25 N,and the residual area is more than 50%.Through the research of optimized process technology,the performance of the developed T/R module can meet the design requirements,and the finished product rate of the T / R module is more than 95% through the GJB548 method 1010 A test A in warm track test.